Alpha To Present Technical Papers on Reliability at SMTA China South Technical Conference in Shenzhen


Posted August 10, 2016 by Alphaassembly

Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, will be presenting two technical papers titled.
 
Somerset, NJ – August 8, 2016 – Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, will be presenting two technical papers titled “Thermal and Mechanical Reliability of Low-Temperature Solder Alloys for Handheld Devices” and “High Reliability Interconnects for High Power LED Assembly” at SMTA China South Technical Conference on August 31, 2016.

The first technical paper, titled “Thermal and Mechanical Reliability of Low-Temperature Solder Alloys for Handheld Devices” will be presented by Andy Yuen, Technical Services Director of Alpha Assembly Solutions Southern China. Andy will discuss the use of micro-additives in eutectic Sn-Bi alloys to improve thermal fatigue and mechanical shock properties for handheld devices.

“We developed a new low temp, Pb-free, no-silver alloy with enhanced mechanical properties, particularly higher tensile strength and impact energy, which resulted in improved drop shock performance over standard SnBi alloy systems” said Andy. “The alloy is capable of delivering high reliability performance at lower soldering temperatures, leading to increased throughput and production value in your assembly process.”

The second paper titled “High Reliability Interconnects for High Power LED Assembly” will be presented by Jackson Chan, Senior Technical Services Manager of Alpha Assembly Solutions. The topic addresses the need and impact for higher reliability interconnects for LED based outdoor and commercial lighting. The presentation will focus on the results of a recent assembly and reliability study of high power ceramic LEDs on aluminum metal core PCBs, and detail the impact of solder alloys on reliability.

SMTA China South Technical Conference
Date: Wednesday, August 31, 2016
Time: 1st Topic: 10:30am -11:05am, 2nd Topic: 13:45pm – 14:20pm
Venue: Room 314, 3/F, Shenzhen Convention & Exhibition Centre, Shenzhen, China
1st Topic: Thermal and Mechanical Reliability of Low-Temperature Solder Alloys for Handheld Devices
Presented by: Andy Yuen, Technical Services Director of Alpha Assembly Solutions
2nd Topic: High Reliability Interconnects for High Power LED Assembly
Presented by: Jackson Chan, Senior Technical Services Manager of Alpha Assembly Solutions

To learn more about Alpha Assembly Solutions vast product offering and capabilities, please visit website at AlphaAssembly.com

Speaker Biographies
Andy Yuen is the Technical Services Director of Alpha Assembly Solutions Southern China. Andy joined Alpha in 1978 and has held technical support responsibilities in the Asia-Pacific Region for more than 30 years. He is a frequent speaker on soldering materials, especially related to Surface Mount Assembly Technology and Reflow/Wave Lead Free Soldering. Andy is a graduate of Queen’s University at Kingston, Ontario, Canada and holds a Bachelor Degree in Chemical Engineering. He is a member of SMTA, IMAPS and ACS.

Jackson Chan has been working in Alpha Assembly Solutions more than 20 years. His responsibilities include troubleshooting, technical training and technical support to the customers. He has a strong experience in the application of various products such as bar, soldering flux and solder paste. He was certified Quality Assurance Auditor in the Hong Kong Standard and Testing Laboratory. From this, he exposed extensively to both system and process audit. Jackson holds a Master of Science (MSc) in Analytical Chemistry from Hong Kong Baptist University.

About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.

For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, visit www.AlphaAssembly.com.

Contact: Andy Yuen
[email protected]
+852 3190-3100
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Contact Email [email protected]
Issued By Laurie Kneller
Website Alpha Assembly Solutions
Phone 908-791-3000
Business Address 300 Atrium Drive, Somerset, 08873, NJ, USA
Country United States
Categories Industry
Tags core solder wire , flux cored solder wire , noclean , rma , selective soldering , solder wire , water soluble
Last Updated August 10, 2016