The Three-dimensional Integrated Circuit & Through-Silicon Via Interconnects Market deals in designing and manufacturing the integrated circuits. 3D IC is an integrated circuit manufactured by stacking silicon wafers and interconnecting them by using through-silicon vias.
TSV technology is being developed for many applications, like MEMS, mobile phone, CMOS image sensor, bioapplication devices, and memory products. Integrated 3D circuit is used in manufacturing the products like light emitting diodes, sensors, power and analog components, micro electro mechanical systems and others. Rising demand for electronic devices is driving the three-dimensional integrated circuit & through-silicon via interconnects market growth.
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Scope & Regional Forecast of the Three-dimensional Integrated Circuit & Through-Silicon Via Interconnects Market
New opportunities are created for the manufacturers because they are allowed to devise consumer electronic devices by Three-dimensional Integrated Circuit & Through-Silicon Via Interconnects Market. The current semiconductor suppliers are expected to expand onto 3D IC technology. The market is expected to have a healthy growth in the future. In terms of revenue the market is still in the early stage and can expect to see an increase in the adoption and revenue generation by the end of the forecast period.
Geographically, Three-dimensional Integrated Circuit & Through-Silicon Via Interconnects Market is segmented into Asia-Pacific, North America, Europe and Rest of the World. Asia-Pacific is expected to have the highest growth till well beyond the forecast period. Also, it is leading the highest position followed by North America and Europe.
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Segmentations & Key Players Involved in the Three-dimensional Integrated Circuit & Through-Silicon Via Interconnects Market
According to IndustryARC findings, the Three-dimensional Integrated Circuit & Through-Silicon Via Interconnects Market can be broken down into various segmentations on the basis of –
Technology: Silicon on insulator and Bulk silicon.
Bonding Technique: Adhesive bonding Die to Die, Die to wafer, Direct bonding, Metallic bonding and Wafer to wafer.
Process Realization: Via First, Via Middle and Via Last.
Fabrication Technology: Beam Recrystallization, Wafer Bonding, Silicon Epitaxial Growth and Solid Phase Crystallization.
Product: Memories, Light emitting diodes,Sensors,Power and analog components, Micro electro mechanical systems and Others.
Region: Americas, Europe, Asia-Pacific and Rest of the Others (RoW).
Some of the key players involved in the Three-dimensional Integrated Circuit & Through-Silicon Via Interconnects Market according to IndustryARC are as follows:
Amkor technology
Micron technology Inc.
NEC electronics corporation
Renesas electronics corporation
Taiwan semiconductor manufacturing company limited
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