On 2025-3-11 Global Info Research released【Global IC Substrates for Memory Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031】. This report includes an overview of the development of the IC Substrates for Memory industry chain, the market status of Consumer Electronics (Nickel-Zinc Ferrite Core, Mn-Zn Ferrite Core), Household Appliances (Nickel-Zinc Ferrite Core, Mn-Zn Ferrite Core), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of IC Substrates for Memory.

According to our (Global Info Research) latest study, the global IC Substrates for Memory market size was valued at US$ 2669 million in 2024 and is forecast to a readjusted size of USD 3805 million by 2031 with a CAGR of 5.7% during review period.

Semiconductor package substrates (IC substrates) play an important role in protecting IC chips from the surrounding environment, ensuring electrical connection for chip mount on printed wiring boards. Demand for high-speed, high-integration and low power consumption of ICs accompanying the rapid progress of electronics technology such as AI, Cloud computing, Intelligentization of automobiles, and due to the miniaturization and thinning of electronic devices typified by smart phone and wearable devices, semiconductor packages are required further high density, multilayer, low-profile.

This report studies the IC substrates for memory (also called memory substrate), including WBCSP, WB-BGA, and FCCSP, used in DRAM (Volatile memory), NAND Flash (Solid-state Drive, Embedded Storage, and Mobile Memory).

Memory devices refer to components that store information using mediums such as magnetic materials or semiconductors. Semiconductor memory specifically leverages semiconductor materials to store electric charges for information retention, with storage and retrieval processes manifested as the charging or discharging of these materials. As a critical branch of integrated circuits, semiconductor memory plays an essential role in modern electronics.

With the exponential growth in data storage demands driven by modern electronic information systems, the shipment volume of semiconductor memory has been experiencing sustained and significant growth. Simultaneously, breakthroughs in semiconductor wafer fabrication, aligned with Moore's Law, have consistently reduced the cost per unit of storage over the long term. As a result, despite short-term supply-demand fluctuations, the overall market scale exhibits a long-term growth trajectory.

Due to the tight integration of layout design and wafer manufacturing technologies, most leading semiconductor memory wafer manufacturers continue to operate under the IDM (Integrated Device Manufacturer) model. However, the IC packaging substrate market for memory devices is relatively fragmented and highly competitive. Key players in this sector are primarily located in regions such as China Taiwan, South Korea, Japan, and Mainland China. Representative companies include Unimicron Technology, Nanya PCB, Shinko Electric Industries, Samsung Electro-Mechanics, Zhen Ding Technology, Daeduck Electronics, LG InnoTek, Shennan Circuit, Shenzhen Fastprint Circuit Tech, and Shenzhen Hemei Jingyi Semiconductor Technology.

This report is a detailed and comprehensive analysis for global IC Substrates for Memory market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.



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Market segment by Type： WB-CSP、WB-BGA、FCCSP

Market segment by Application：Memory Modules、Solid-state Drive、Embedded Storage、Mobile Memory

Major players covered： Unimicron、Samsung Electro-Mechanics、Nan Ya PCB、Shinko Electric Industries、Zhen Ding Technology、Daeduck Electronics、LG InnoTek、DAISHO DENSHI、Korea Circuit、Shennan Circuit、Shenzhen Fastprint Circuit Tech、Shenzhen Hemei Jingyi Semiconductor Technology、Hong Yuen Electronics、Huizhou China Eagle Electronic Technology

Market segment by region, regional analysis covers: North America (United States, Canada and Mexico), Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe), Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia),South America (Brazil, Argentina, Colombia, and Rest of South America),Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa).

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe IC Substrates for Memory product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of IC Substrates for Memory, with price, sales, revenue and global market share of IC Substrates for Memory from 2020 to 2025.

Chapter 3, the IC Substrates for Memory competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the IC Substrates for Memory breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2020 to 2024.and IC Substrates for Memory market forecast, by regions, type and application, with sales and revenue, from 2025 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of IC Substrates for Memory.

Chapter 14 and 15, to describe IC Substrates for Memory sales channel, distributors, customers, research findings and conclusion.

Data Sources:

Via authorized organizations:customs statistics, industrial associations, relevant international societies, and academic publications etc.

Via trusted Internet sources.Such as industry news, publications on this industry, annual reports of public companies, Bloomberg Business, Wind Info, Hoovers, Factiva (Dow Jones & Company), Trading Economics, News Network, Statista, Federal Reserve Economic Data, BIS Statistics, ICIS, Companies House Documentsm, investor presentations, SEC filings of companies, etc.

Via interviews. Our interviewees includes manufacturers, related companies, industry experts, distributors, business (sales) staff, directors, CEO, marketing executives, executives from related industries/organizations, customers and raw material suppliers to obtain the latest information on the primary market;

Via data exchange. We have been consulting in this industry for 16 years and have collaborations with the players in this field. Thus, we get access to (part of) their unpublished data, by exchanging with them the data we have.

From our partners.We have information agencies as partners and they are located worldwide, thus we get (or purchase) the latest data from them.

Via our long-term tracking and gathering of data from this industry.We have a database that contains history data regarding the market.
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