The thick-film hybrid scheme was created using the pressure and flame (P+F) technique. This includes combined screen printing of precious and semi-precious metals (Au, Ag, Pd) with a multilayer coating and precise firing of conductors and resistance tracks on various ceramic and metal substrates. The use of different pastes allows the production of individually adjustable and then high-precision laser-cut wires and resistors with the right choice of values and without compromising on design.

SMD components and matrix elements with bare wires can also be integrated, and optional full-encapsulation offers environmental protection.

Thick film hybrids are ideal for environments where a high level of reliability is required because they can withstand a much more comprehensive temperature range and have more excellent durability than traditional printed circuit boards. Our hybrid technology provides the best circuit board.

Thick film technology is widely used in aerospace, defence, and automotive applications. Its durable and reliable character is starting to gain popularity on the broader market. As a company experienced in this technology, we are the perfect partner to develop and manufacture thick film panels for every application. We use hybrid tech for building your circuit board.

Main advantages of using our circuit board:-

• High reliability for harsh conditions
• Flexibility in choosing the correct resistance value in active laser cutting
• High voltage resistor
• The extended temperature range function
• Improved thermal management
• Excellent high-frequency properties
• Low start-up costs
• Fast delivery time to prototype

Ceramic substrates offer several defining advantages over standard FR4-based PCBs. One of the main advantages is their thermal conductivity. For example, alumina (alumina) offers an increase in thermal conductivity of about 20 times greater than FR4, and alumina offers an increase of about 100 times.

Another advantage of ceramic bases is that they offer shallow thermal expansion properties. This makes it ideal for use in harsh environments where temperature extremes are possible. The combination of low thermal expansion and high thermal conductivity ensures limited and even distribution of thermal expansion over the entire plane, limiting the possibility of high stresses in a given area.

Contact Us-

Address: 9 Trenton Lakewood Road Clarksburg, NJ 08510
Contact: (609) 259-3355
Email: [email protected]
Website: http://hybrid-tek.com/