Wafer Inspection Equipment Market SWOT Analysis by Top Key Players and Forecast Report to 2026


Posted July 10, 2020 by rohit890

Wafer inspection equipment is fabrication system utilized for the detection of defects during the semiconductor wafer manufacturing processes.
 
Market Overview

Wafer inspection equipment is fabrication system utilized for the detection of defects during the semiconductor wafer manufacturing processes. Increasing application of electronic semiconductor ICs in consumer electronics, industrial, automobile segments and related R&D activities is expected to drive the increased demands for the production. Requirement to maintain the quality of products and the client satisfaction is expected to remain the primary factor that would fuel the wafer inspection equipment market growth.

Advanced wireless networking technologies such as 3G, 4G, Bluetooth, ZigBee, and wireless LAN have enabled fast and easy data transmission. Smartphones, tablets, wearables and sensors integrating these technologies have witnessed significant demand increase over the past few years. In conjunction with the demands for high level integration and development of new designs to provide support to multiple application on single platforms, intensive industry competition has led to increased demands for better quality and least defects in the semiconductor devices. Moreover, increasing demands for high performance chips for mission critical applications in industries and R&D activities will present considerable growth opportunities for the wafer inspection equipment market through the forecast period.

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Market Dynammics

Optical and E-beam are complementary technologies that perform distinct operations in the workflow. optical has fast throughputs and finds great applications in the end use. On the other hand E-beam helps in detection of smallest defects, however the throughputs are low. Owing to these features, it finds substantial applications in R&D activities. Increasing demands for advanced computing and processing has led to development of 3D finFETs, NAND and advanced DRAMs, which requires the tools to assess complex structures. Wafer assessment on the scales below 10 nm is extremely difficult, and in case of overlooking of the smallest error can impact the end use. This is expected to be major industry growth challenge over the next coming years.

Asia Pacific is the largest hub for the electronic semiconductor manufacturing activities, driven by the extensive production demands specifically in the countries that include China, Taiwan, Japan and South Korea. Moreover, the region is also attributed with the presence of key electronic industry participants such as Samsung, Sony, Toshiba, Panasonic, among many others, which will help the region sustain its dominance over the next few years.

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Key players in the wafer inspection equipment market include Applied Materials, Zeiss Global, Hermes Microvision (ASML), FEI (Thermo Fisher Scientific), KLA-Tencor, Hitachi High-Technologies, JEOL, Lasec Corporation, Lam Research, Nikon, Nanometrics, Planar Corporation, Tokyo Seimitsu, Rudolph Technologies, and Toray Engineering

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Last Updated July 10, 2020