Chip-on-Flex, or COF, refers to the semiconductor wherein the microchip is specifically mounted on and electrically associated with a flexible circuit (a circuit-based on an adaptable substrate rather than the typical printed circuit board).

Consequently, in a COF assemble, the microchip doesn't need to experience all the customary gathering steps required for singular IC packaging. This rearranges the general procedure of designing and manufacturing the final product while enhancing its execution because of the shorter interconnection ways.

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The major drivers for the growth of the market are expanding requirement for little and adaptable hardware in different applications; for example, shows, sensors, lighting, biomedical implants, and radio frequency identification among others and the fast, innovative progressions that prompt precise plans and computerized generation of flex circuits that disposes human mistakes once associated with hand-manufactured wire outfits.


With the utilization of these adaptable circuit board organizations there will be 100% effectiveness guaranteed in the items, because of which the level of fault ratio is radically diminished. Chip on flex helps decrease the cost, enhances administrator ergonomics, opens up the item quality, and tests repeatability. However, the cost and complexities related to the development of the product will act as a restraint for the market. The opportunity lies in the fact that the technologies that drive the chip on flex are constantly developed and can be used more efficiently & effectively.

The chip on flex market is divided into type, application, verticals, and geography. The type is further divided into single sided chip on flex and others. The application is segmented into static and dynamic. The verticals are divided into military, medical, aerospace, and electronics. The region wise divisions are North-America, Europe, Asia-Pacific, and LAMEA. The key players mentioned in the report are AKM Industrial, Chipbond Technology, Compass Technology Company, Compunetics, CWE, Danbond Technology, Flexceed, LGIT, STARS Microelectronics, and Stemco.

Key Benefits

• This report provides an extensive analysis of the current & emerging market trends, dynamics, and estimations for key market segments in the global chip on flex market from 2017 to 2023.
• Exhaustive analysis of the market by type, application, and verticals helps understand the current trends in use and the variants that are expected to gain prominence in future.
• This report presents a competitive intelligence of the market to understand the competitive scenario globally.

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